HT‑90 90x90 BGA Reballing Station, Aluminum Alloy BGA Reballing Stencil, BGA Reball Stencil for 9-43mm BGA Chip and Laptop CPU Mobile Phone Rework

★★★★★ 4.7 124 reviews

$32.99
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$32.99
Price when purchased online
Free shipping Free 30-day returns

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Product details

Management number 210127988 Release Date 2026/04/02 List Price $13.20 Model Number 210127988
Category

Item Type: BGA Reballing StationProduct Model: HT-90 90x90Applicable Steel Mesh: Approx. 90 x 90mm / 3.5 x 3.5inApplication Chip: Minimum clamping chip: approx. 9 x 9mm / 0.4 x 0.4in, maximum clamping chip: approx. 43 x 43mm / 1.7 x 1.7inMaterial: Aluminum alloyApplication: BGA manual soldering for plant tin rework of notebook computer CPU and mobile phone digital products.Package List:1 x BGA Reballing Station1 x Hex Wrench

  • ALUMINUM ALLOY: The BGA reballing station combines lightweight portability with steady support for repeated heating cycles during component repairs
  • EASY TO USE: The BGA reballing stencil is marked on the exterior, convenient for you to choose and use them on the reballing station
  • CHIP COMPATIBILITY: This BGA reball stencil handles chips from 9mm to 43mm, using metal plating to help heat spread evenly during reflow
  • DIVERSION GROOVE: The reballing kit includes adjustable sizing dials and spillway channels to quickly remove extra solder without interrupting tasks
  • APPLICATION: The BGA rework station can be used for laptop CPU, mobile phone digital products plant tin rework with BGA manual welding
Display digital
Wattage 200 watts
Brand Name CYTGOUPER
Item Weight 0.82 Pounds
Manufacturer CYTGOUPER
Model Number CYTGOUPER314DJZZT
Number of Channels 2
Included Components 1 x BGA Reballing Station 1 x Hex Wrench
Temperature Stability 480 degrees_celsius
Manufacturer Part Number CYTGOUPER314DJZZT
Upper Temperature Rating 480 Degrees Celsius

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4.7 out of 5
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124 ratings | 51 reviews
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